A method is presented in which an active element, e.g. a semiconductor device, is embedded in a passive circuitry formed on a low-cost substrate, having good dielectric properties. After forming the active element on a first substrate, the active elements are singulated and transferred to a second substrate....http://www.google.com.tw/patents/US6812078?utm_source=gb-gplus-share專利 US6812078 - Method for transferring and stacking of semiconductor devices
