Methods for forming vias are disclosed. The methods include providing a substrate having a first surface and an opposing, second surface. A first opening, a second opening, and a third opening are formed in a substrate such that the first opening, the second opening, and the third opening are in communication...http://www.google.com.tw/patents/US7528491?utm_source=gb-gplus-share專利 US7528491 - Semiconductor components and assemblies including vias of varying lateral dimensions
