Embodiments of the present invention provide a new method for producing a three dimensional object, particularly suited to microfabrication applications. The method includes the steps of providing a substrate with a conducting interface, an electrode having a feature or features that are small relative...http://www.google.com.tw/patents/US5641391?utm_source=gb-gplus-share專利 US5641391 - Three dimensional microfabrication by localized electrodeposition and etching
