An integrated circuit packaging system is provided including forming a first device wafer having a first backside and a first active side; forming a waferscale spacer wafer having a waferscale spacer and a first opening; mounting the waferscale spacer wafer on the first backside; and singulating an first...http://www.google.com.tw/patents/US20080042245?utm_source=gb-gplus-share專利 US20080042245 - INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER
