In a flip-chip type semiconductor device, a plurality of pad electrodes are formed on a semiconductor substrate. An insulating stress-absorbing resin layer made of thermosetting resin is adhered to the substrate as a composite layer in conjunction with a first conductive layer and has openings corresponding...http://www.google.com.tw/patents/US6696317?utm_source=gb-gplus-share專利 US6696317 - Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin
