An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a...http://www.google.com.tw/patents/US7677429?utm_source=gb-gplus-share專利 US7677429 - Concave face wire bond capillary and method
