In a spread illuminating apparatus including: an LED at a side surface of a light conductor plate; and an FPC having a land formed on a side thereof for mounting the LED, throughholes are formed at the land, and solder is contained at least partly in each of the throughholes, whereby the LED can be mounted...http://www.google.com.tw/patents/US7532479?utm_source=gb-gplus-share專利 US7532479 - Spread illuminating apparatus
