A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers....http://www.google.com.tw/patents/US5976391?utm_source=gb-gplus-share專利 US5976391 - Continuous Flexible chemically-milled circuit assembly with multiple conductor layers and method of making same
