Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os,...http://www.google.com.tw/patents/US7556189?utm_source=gb-gplus-share專利 US7556189 - Lead-free bonding systems
