Methods of inspecting a microstructure comprise: applying charged particles to the wafer to negatively charge up the wafer over a region having contact or via holes, scanning a charged-particle beam over the region while detecting secondary particles so as to produce a detector signal, determining from...http://www.google.com.tw/patents/US6232787?utm_source=gb-gplus-share專利 US6232787 - Microstructure defect detection
