A method of manufacturing packages for LSI chips starts with the usual steps of punching holes in green sheets, screening patterning paste (adapted to form cermet conductors or the like after firing) onto the green sheets, and inspecting the green sheets optically. Here, subsets of green sheets are then...http://www.google.com.tw/patents/US4578279?utm_source=gb-gplus-share專利 US4578279 - Inspection of multilayer ceramic circuit modules by electrical inspection of unfired green sheets
