A flexible wiring board is provided which is made of a relatively thin polyimide film and, thus, can be bent easily. Therefore, the flexible wiring board can be bent easily in the vicinity of a semiconductor chip mounting region without forming slits for facilitating the bending in the film substrate....http://www.google.com.tw/patents/US6433414?utm_source=gb-gplus-share專利 US6433414 - Method of manufacturing flexible wiring board
