A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board....http://www.google.com.tw/patents/US6291269?utm_source=gb-gplus-share專利 US6291269 - Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip
