A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit...http://www.google.com.tw/patents/US6841419?utm_source=gb-gplus-share專利 US6841419 - Method of fabricating a COF utilizing a tapered IC chip and chip mounting hole
