Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two...http://www.google.com.tw/patents/US7199470?utm_source=gb-gplus-share專利 US7199470 - Surface-mountable semiconductor component and method for producing it
