In an integrated circuit package of the type in which multiple conductors are bonded between an integrated circuit chip and the body of the package, wire bonds are tested for defects by a method which includes the steps of: placing the integrated circuit package in a magnetic field; generating respective...http://www.google.com.tw/patents/US4677370?utm_source=gb-gplus-share專利 US4677370 - Method of testing wire bonds for defects using a magnetic field
