A method of making a microelectronic assembly includes providing a microelectronic package having a substrate, a microelectronic element overlying the substrate and at least two conductive elements projecting from a surface of the substrate, the at least two conductive elements having surfaces remote...http://www.google.com.tw/patents/US8058101?utm_source=gb-gplus-share專利 US8058101 - Microelectronic packages and methods therefor
