A method and apparatus utilizing a thermal release mounting material to adhere a laser wafer to a wafer support during a semiconductor fabrication process is provided. A first surface of the mounting material contains an adhesive and is adhered to a wafer support. The wafer support contains apertures...http://www.google.com.tw/patents/US6142853?utm_source=gb-gplus-share專利 US6142853 - Method and apparatus for holding laser wafers during a fabrication process to minimize breakage
