A method for fabricating a metallization structure comprises depositing a first metal layer; depositing a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposes said first metal layer; depositing a second metal layer over said first metal...http://www.google.com.tw/patents/US7452803?utm_source=gb-gplus-share專利 US7452803 - Method for fabricating chip structure
