A full width read and/or write assemblies, such as a full width thermal ink jet printbar, is disclosed, having materials with both a high thermal coefficient of expansion and a low thermal coefficient of expansion. A suitable adhesive which provides lateral give while firmly holding the respective components...http://www.google.com.tw/patents/US5528272?utm_source=gb-gplus-share專利 US5528272 - Full width array read or write bars having low induced thermal stress
