A semiconductor device for a microwave circuit includes a semiconductor substrate with an active element formed in the top surface, surface wirings on the top surface of the semiconductor substrate which are connected to terminals of the active element, and rear electrodes on the rear surface of the...http://www.google.com.tw/patents/US5949140?utm_source=gb-gplus-share專利 US5949140 - Microwave semiconductor device with via holes and associated structure
