First and second electrodes and first and second electrical connection portions are overlapped and electrically connected. A first substrate includes: an attachment portion, a connection portion and an extension portion, the attachment portion being attached to the second substrate, the connection portion...http://www.google.com.tw/patents/US6917104?utm_source=gb-gplus-share專利 US6917104 - Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
