An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame...http://www.google.com.tw/patents/US5327010?utm_source=gb-gplus-share專利 US5327010 - IC card having adhesion-preventing sheets
