A method for mounting a dielectric substrate to a semiconductor substrate, such as mounting a dielectric antenna substrate to an MMIC semiconductor substrate. The method includes providing a thin dielectric antenna substrate having metallized layers on opposing sides. In one embodiment, carrier wafers...http://www.google.com.tw/patents/US7696062?utm_source=gb-gplus-share專利 US7696062 - Method of batch integration of low dielectric substrates with MMICs
