An integrated circuit lead assembly structure is disclosed which comprises one or more pc boards, having a first lead pattern adjacent one surface of a pc board and a second lead pattern adjacent another surface of a pc board with at least a portion of the leads of the first lead pattern running perpendicular...http://www.google.com.tw/patents/US5063432?utm_source=gb-gplus-share專利 US5063432 - Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
