Integrated circuitry and methods of forming integrated circuitry are described. In one aspect, a hole is formed in a semiconductor wafer. In a preferred implementation, the hole extends through the entire wafer. Subsequently, conductive material is formed within the hole and interconnects with integrated...http://www.google.com.tw/patents/US6187677?utm_source=gb-gplus-share專利 US6187677 - Integrated circuitry and methods of forming integrated circuitry
