Method for controlling the deposition of solder on a heat spreader or heat sink is disclosed. The method comprises applying an attaching flux and finishing flux to a heat spreader, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the...http://www.google.com.tw/patents/US20070051774?utm_source=gb-gplus-share專利 US20070051774 - Method of controlling solder deposition on heat spreader used for semiconductor package
