Flared and non-flared metallized deep vias having aspect ratios of about 2 or greater are provided. Blind vias have been fabricated in silicon substrates up to a depth of about 300 microns, and flared through vias have been fabricated up to about 750 microns, the approximate thickness of a silicon substrate...http://www.google.com.tw/patents/US20050037608?utm_source=gb-gplus-share專利 US20050037608 - Deep filled vias
