A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and forming a trench on the lid wafer between the lid cavity and the sealing surface. The resulting structure...http://www.google.com.tw/patents/US20040219764?utm_source=gb-gplus-share專利 US20040219764 - Vacuum package fabrication of integrated circuit components
