A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of the tape beyond the normal...http://www.google.com.tw/patents/US6538463?utm_source=gb-gplus-share專利 US6538463 - Semiconductor die and retaining fixture
