A semiconductor wafer is affixed on a dicing sheet having an appropriate expansibility. Then, a dicing operation is performed on the semiconductor wafer without dividing the dicing sheet, thereby dividing a plurality of semiconductor chips from each other. After aligning a contactor against the semiconductor...http://www.google.com.tw/patents/US5605844?utm_source=gb-gplus-share專利 US5605844 - Inspecting method for semiconductor devices
