A semiconductor die having raised conductive bumps on its surface for connecting to other devices or systems is disposed on a face of a preformed planar structure (interposer) having through holes. Solder joints with conductive bumps on an underlying substrate are formed in the through holes. In one...http://www.google.com.tw/patents/US5569963?utm_source=gb-gplus-share專利 US5569963 - Preformed planar structures for semiconductor device assemblies
