A semiconductor assembly (300) comprising a semiconductor device (301), which has a plurality of metallic contact pads (302) and an outline by sides (303). A metallic bump (304) made of reflowable metal is attached to each of these contact pads. An electrically insulating substrate (305) has a surface...http://www.google.com.tw/patents/US7033864?utm_source=gb-gplus-share專利 US7033864 - Grooved substrates for uniform underfilling solder ball assembled electronic devices
