A method and apparatus for packaging a semiconductor die with an interposer substrate. A semiconductor device assembly includes a conductively bumped semiconductor die and an interposer substrate having multiple recesses formed therein. The semiconductor die is mounted to the interposer substrate with...http://www.google.com.tw/patents/US7531906?utm_source=gb-gplus-share專利 US7531906 - Flip chip packaging using recessed interposer terminals
