A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power supply terminals, in which a pair...http://www.google.com.tw/patents/US7459765?utm_source=gb-gplus-share專利 US7459765 - Semiconductor apparatus with decoupling capacitor
