A device comprising a workpiece (401) with a surface (401a) including a center (402) and an array of bond pads (420), further an array of interconnects (405) of uniform height. Each of these interconnects comprises an elongated wire loop, which has both wire ends (440, 450) attached to one of the bond...http://www.google.com.tw/patents/US20050133928?utm_source=gb-gplus-share專利 US20050133928 - Wire loop grid array package
