A semiconductor package and a fabricating method thereof are proposed. The semiconductor package includes a semiconductor chip; a plurality of leads surrounding the chip and formed with a plurality of connecting mechanisms and strengthening structures; and an encapsulant for encapsulating the chip and...http://www.google.com.tw/patents/US20040016994?utm_source=gb-gplus-share專利 US20040016994 - Semiconductor package and fabricating method thereof
