Signal adaptor board for a pin grid array

United States Patent [w]

Menzies et al.

[54] SIGNAL ADAPTOR BOARD FOR A PIN GRID ARRAY

[75] Inventors: L. William Menzies, Redwood City;

Stephen W. Menzies, El Dorado Hills;
Dale S. Mackey, San Jose, all of Calif.

[73] Assignee: Concept Manufacturing,

Incorporated, El Dorado Hills, Calif.

[21] Appl. No.: 08/735,832 [22] Filed: Oct. 23, 1996

[51] Int. C I. H05K 1 18

[52] U.S. CI 361/790; 361/767; 361/768;

361/735; 361/785; 361/683; 361/791; 361/700; 361/777; 439/70; 439/60; 439/68; 439/75; 257/692; 257/700; 257/713; 257/717

[58] Field of Search 361/790, 767,

361/768, 735, 785, 683, 791, 700, 777; 439/70, 60, 68, 75; 257/692, 700, 713,

717

[56] References Cited

U.S. PATENT DOCUMENTS

Re. 31,929 6/1985 Donaher et al 361/396

3.846,734 11/1974 Pauza et al 439/70

3,875,478 4/1975 Capstick 361/403

4,356,532 10/1982 Donaher et al 361/396

4,494,172 1/1985 Leary et al 361/400

4,519,658 5/1985 Biswas 361/393

4,626,958 12/1986 Lockhard et al 357/74

4,636,918 1/1987 Jodoin 361/405

4,779,164 10/1988 Menzies, Jr. et al 361/393

4,882,656 11/1989 Menzies, Jr. et al 361/393

4,912,401 3/1990 Nady et al 324/158

5,061,989 10/1991 Yen et al 257/692

5,168,432 12/1992 Murphy et al 361/813

5,205,741 4/1993 Steen et al 439/70

5,310,574 5/1994 Holtmann 427/58

5,445,526 8/1995 Hoshino et al 439/69

5,460,531 10/1995 Vivio 439/70

5,481,435 1/1996 Werther 361/784

5,585,671 12/1996 Nagesh et al 257/697

OTHER PUBLICATIONS

The Interconnection Specialists, Catalogue 201, IC Sockets (front page, preface, table of contents and pp. A-5, A-6, A-7, A-8, A-ll, A-12, A-51 and A-52), EMC (Electronic Molding Corporation) Woonsocket, RI 02895. Rogers "Micro-Q Decoupling Capacitors", Rogers Corporation, Tempe, Arizona, 1985.

"The Silencer IC Sockets with Decoupling Capacitors",
Electronic Molding Corporation, Woonsocket, Rhode
Island. Sep., 1986.

"Surface Mounted Decoupling Capacitor Sockets",
Advanced Interconnections Warwick, Rhode Island.
Garry Product Bulletin, "Hi-Rel I.C. Sockets with Integral
Decoupling Capacitors", Garry, Langhorne, PA. Jan., 1982.
Berg Electronics Brochure, McKenzie Socket Division,
"Application Specific Modules Capabilities".

Primary Examiner—Leo P. Picard
Assistant Examiner—David Foster

Attorney, Agent, or Firm—Skjerven Morrill MacPherson
Franklin & Friel LLP; Thomas S. MacDonald

[57] ABSTRACT

An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided by the PCB. The interconnect structure includes sockets that provideA. conductive paths between the circuit board and some, but not all, of the leads on the package. To adapt the signals, the interconnect structure also includes an intermediate adaptor board that includes one or more electrical components. The adaptor board and the sockets fit beneath the package containing the IC and above the PCB, and do not extend beyond the lateral boundaries of the package. Heat generated by these components during operation of the IC is dissipated through the IC package via a layer of thermally conductive material sandwiched between the component and the package. The intermediate adaptor board and the socket combine to perform all necessary signal conversion, including power supply voltage levels, between the circuit board and the IC.

11 Claims, 6 Drawing Sheets