A method for forming wafers having through-wafer vias for wafer-level packaging of devices, the method comprising the steps of depositing metal on one of two wafers; bonding the two wafers using the metal deposited on the one of the two wafers; forming a through-wafer via in one of the two wafers; filling...http://www.google.com.tw/patents/US6846725?utm_source=gb-gplus-share專利 US6846725 - Wafer-level package for micro-electro-mechanical systems
