A semiconductor wafer saw and method of using the same for dicing semiconductor wafers comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor...http://www.google.com.tw/patents/US6423616?utm_source=gb-gplus-share專利 US6423616 - Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
