Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I/O connections. It allows 2.5D and 3D stacking of components to enable homogenous and heterogenous integration.

Chip on Wafer on Substrate (CoWoS) technology revolutionizes semiconductor integration by stacking chips on a single substrate. This method offers benefits like enhanced performance, reduced footprint, and improved power efficiency.

Nvidia's B100 and B200 GPUs are the industry's first products to use TSMC's CoWoS-L packaging with a ¡§super carrier interposer.¡¨ This enables the building of systems-in-package up to six times the reticle size by using active or passive local silicon interconnect (LSI) bridges integrated into an RDL interposer (instead ...

CoWoS®-L is one of the last for chip packages in the CoWoS® platform, combining the merits of CoWoS®-S and InFO technologies to provide the most flexible integration using interposer with LSI (Local Silicon Interconnect) chip for die-to-die interconnect and RDL layers for power and signal delivery.