Chinese manufacturers have some CoWoS capacity, primarily through CoW+WoS process integration. Advanced logic chips and interposers in China are mainly...
5 months ago

It is said that TSMC 3nm pricing is expected to receive a bump of up to 5%, while CoWoS packaging could rise by 10% to 20%, depending upon how...
1 month ago

The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60000 wafers per month in...
3 months ago

Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by...
1 month ago

TSMC's production capacity for CoWoS packaging is forecast to grow at a CAGR of more than 50% from 2023 to 2028, according to DIGITIMES...
3 months ago

Multi-protocol subsystem delivers 8 Tbps/mm bandwidth density and 24 Gbps D2D data rate for hyperscale, HPC, and AI applications.
2 months ago

NVIDIA Renames Blackwell Ultra to B300 Series; CoWoS-L Expected to See Growth by 2025, Says TrendForce ... TrendForce reports that NVIDIA has...
1 month ago

TSMC announced that they are developing the means of building super-sized interposers that can reach over 8x the reticle limit.
7 months ago

TSMC & US-Based Amkor Technologies To Bring In CoWoS Production Into The US, Pivotal Moment For The AI Markets ... TSMC and Amkor Technologies are...
2 months ago

TSMC halts construction of CoWoS plant in Taiwan after 'archaeological ruins' discovered ... TSMC has been forced to halt construction work at its...
5 months ago