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TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026

AnandTech
TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026.
6 months ago

TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

Tom's Hardware
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
1 week ago

TSMC adjusts CoWoS capacity plans amid Trump 2.0 uncertainty

DIGITIMES Asia
The company's latest projections now target monthly CoWoS capacity of approximately 35,000 units for 2024, 75,000 units for 2025, and 135,000 units for 2026 -...
3 weeks ago

[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities

TrendForce
The production capacity of CoWoS packaging technology has become a significant bottleneck in AI chip output over the past year.
9 months ago

TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand

Wccftech
TSMC is set to upscale its CoWoS packaging facilities, as the Taiwan giant plans to spend almost US $16 billion on building new facilities.
8 months ago

TSMC halts construction of CoWoS plant in Taiwan after ”„archaeological ruins”¦ discovered

Data Center Dynamics
TSMC halts construction of CoWoS plant in Taiwan after 'archaeological ruins' discovered ... TSMC has been forced to halt construction work at its CoWoS (Chip-on-...
5 months ago

Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research

DIGITIMES Asia
Due to robust demand for CoWoS and similar packaging capacities, TSMC and ASE (including SPIL) are ramping up their related capacities to meet customers' needs.
1 month ago

TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's

AnandTech
TSMC announced that they are developing the means of building super-sized interposers that can reach over 8x the reticle limit.
7 months ago

Amkor and TSMC team up for advanced packaging in the U.S. ”X CoWoS and InFo to make AI and HPC CPUs

Tom's Hardware
Amkor will offer TSMC's advanced CoWoS and InFo chip packaging for AI and HPC processors in the U.S..
2 months ago

[News] TSMC”¦s CoWoS Prices May Rise 20%; ASE and Amkor Compete for Outsourcing Orders

TrendForce
TSMC has received approval from NVIDIA to raise prices next year, with CoWoS packaging expected to increase by 10% to 20%, depending on capacity expansion.
1 month ago