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[News] TSMCˇ¦s CoWoS Prices May Rise 20%; ASE and Amkor Compete for Outsourcing Orders
TrendForce
Driven by booming demand for AI chips, TSMC's advanced CoWoS (Chip on Wafer on Substrate) packaging faces a significant supply shortage. In response, ...
5 days ago
Nvidia has renamed its Blackwell Ultra product series ˇX hereˇ¦s why
TechRadar
The move by Nvidia marks a strategic shift aimed at promoting CoWoS technology, analysts suggest.
6 days ago
TSMC Expected To Bump Up 3nm & CoWoS Pricing Moving Into 2025 Amid Massive Market Demand & Supply Chain Bottlenecks
Wccftech
TSMC is reportedly considering raising prices for its in-demand 3nm and CoWoS processes in an attempt to cope with the gigantic demand.
1 week ago
Global CoWoS and CoWoS-like packaging capacity demand to surge 113% on year in 2025, says DIGITIMES Research
DIGITIMES Asia
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand...
1 week ago
Hon Precision secures orders from top US CSPs, riding the CoWoS growth wave
DIGITIMES Asia
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend...
1 week ago
Fig. 1. Interposer size has been increased in the past few years to...
ResearchGate
The limitation for interposer die area was soon extended and a CoWoS-based FPGA product with interposer size ∼1200 mm 2 has been proposed [4]. In 2016, with the...
1 week ago
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
DIGITIMES Asia
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision...
1 week ago
[New] TSMC and SPIL Unveil New Advanced Node and CoWoS Expansion Efforts in Taiwan
TrendForce
Taiwan's semiconductor manufacturing is making strides in advanced process and packaging expansion. TSMC's new 2nm fab in Kaohsiung will hold a tool-i...
1 week ago
NVIDIA Blackwell Ultra AI GPUs To Be Called B300, Feature 12-Hi HBM3E & TSMC CoWoS-L Tech
Wccftech
NVIDIA's "Blackwell Ultra" is now renamed as the "B300" series, with high-end GPUs and server products now being shifted to the new naming.
2 weeks ago
NVIDIA Renames Blackwell Ultra to B300 Series; CoWoS-L Expected to See Growth by 2025
TrendForce
NVIDIA Renames Blackwell Ultra to B300 Series; CoWoS-L Expected to See Growth by 2025, Says TrendForce ... TrendForce reports that NVIDIA has recently rebranded...
2 weeks ago