TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve...
3 days ago

TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
1 week ago

According to a report from TechNews, citing Tom's Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its...
6 days ago

TSMC is "rushing" towards improving CoWoS production as the immense demand from the markets starts to gobble up the whole supply chain.
1 week ago

TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026.
6 months ago

TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
1 week ago

TSMC is considering building new CoWoS advanced packaging plants in the US and Japan due to strong demand, particularly for AI chips from NVIDIA.
3 weeks ago

TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
1 week ago

The company's latest projections now target monthly CoWoS capacity of approximately 35,000 units for 2024, 75,000 units for 2025, and 135,000...
2 weeks ago

TSMC is also reportedly negotiating to acquire a second facility from Innolux. Meanwhile, its Chiayi fab is targeting equipment delivery by the...
2 weeks ago