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TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

Tom's Hardware
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
2 weeks ago

TSMC adjusts CoWoS capacity plans amid Trump 2.0 uncertainty

DIGITIMES Asia
The company's latest projections now target monthly CoWoS capacity of approximately 35,000 units for 2024, 75,000 units for 2025, and 135,000 units for 2026 -...
3 weeks ago

[News] TSMC Reportedly Slows Down CoWoS Capacity Expansion for 2026

TrendForce
TSMC is also reportedly negotiating to acquire a second facility from Innolux. Meanwhile, its Chiayi fab is targeting equipment delivery by the end of 2025 and...
3 weeks ago

TSMC To Significantly Upscale ˇ§CoWoSˇ¨ Production Within The Upcoming Quarters, Reaching Up To 130,000 Monthly Output By 2026

Wccftech
TSMC is "rushing" towards improving CoWoS production as the immense demand from the markets starts to gobble up the whole supply chain.
2 weeks ago

TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

Yahoo
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
2 weeks ago

[News] TSMC on Track to Qualify Ultra-Large CoWoS with 9x Reticle Sizes, 12 HBM4 Stacks by 2027

TrendForce
According to a report from TechNews, citing Tom's Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large ...
2 weeks ago

TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027

DIGITIMES Asia
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027,...
1 week ago

Taiwan Semiconductor Manufacturing Company Limited (TSM) Poised for Growth as NVIDIA Drives AI Demand, Citi Highlights Doubling CoWoS Capacity by 2025

Yahoo Finance
We recently compiled a list of the 15 AI Stocks Making Waves on Wall Street. In this article, we are going to take a look at where Taiwan Semiconductor...
3 weeks ago

NVIDIA's next-gen GB300 AI platform in mid-2025: more perf than GB200, fully liquid-cooled

TweakTown
NVIDIA's next-generation GB300 'Blackwell Ultra' AI servers expected to debut in mid-2025: fully-liquid cooled, 12-Hi HBM3E memory, TSMC CoWoS-L packaging.
1 week ago

Nvidia secures 60% of TSMC's doubled CoWoS capacity for 2025

DIGITIMES Asia
TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia...
3 weeks ago