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Broadcom unveils gigantic 3.5D XDSiP platform for AI XPUs ¡X 6000mm² of stacked silicon with 12 HBM modules

Tom's Hardware
Broadcom's 3.5D XDSiP platform for high-performance processors uses TSMC's CoWoS and other packaging technologies to build a system-in-packages comprising...
4 days ago

Tariff tangle: Nvidia Blackwells might be made by TSMC in US, but packaged in Taiwan

Fierce Electronics
The incoming Trump administration promises to impose tariffs on many products shipped to the US from abroad in the president-elect's bold effort to see...
6 days ago

Apple Inc (AAPL-Q) Quote - Press Release

The Globe and Mail
Reports that NVIDIA (NASDAQ: NVDA) could make its Blackwell chips are resonating throughout the semiconductor industry. The news is good for numerous...
6 days ago

Fujitsu flaunts massive 144-core Monaka Arm chip ¡X 2nm and 5nm chiplets, 3D-stacked CPU cores over memory

Tom's Hardware
Fujitsu's Monaka is a monstrous processor with four 2nm compute chiplets, 5nm SRAM, and a massive 5nm IO die. This time, without HBM memory.
9 hours ago

NVIDIA¡¦s Ambitious Tech Leap: Could the Next Big Surprise Skyrocket Stock Prices?

smartphonemagazine.nl
In the ever-evolving semiconductor landscape, NVIDIA's strategic moves are capturing industry attention. Reports indicate potential advancements with...
6 days ago