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TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026
AnandTech
TSMC announced plans to expand CoWoS capacity at a compound annual growth rate (CAGR) of over 60% till at least 2026.
5 months ago
[News] CoWoS Capacity Shortage Challenges AI Chip Demand, while Taiwanese Manufacturers Expand to Seize Opportunities
TrendForce
The production capacity of CoWoS packaging technology has become a significant bottleneck in AI chip output over the past year.
8 months ago
TSMC halts construction of CoWoS plant in Taiwan after ¡¥archaeological ruins¡¦ discovered
Data Center Dynamics
TSMC halts construction of CoWoS plant in Taiwan after 'archaeological ruins' discovered ... TSMC has been forced to halt construction work at its CoWoS (Chip-on-...
4 months ago
TSMC To Invest $16 Billion Into Six New CoWoS Facilities In Taiwan As It Anticipates Huge AI Demand
Wccftech
TSMC is set to upscale its CoWoS packaging facilities, as the Taiwan giant plans to spend almost US $16 billion on building new facilities.
7 months ago
TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
Taiwan Semiconductor Manufacturing Company
SANTA CLARA, CA, Apr. 24, 2024 ¡V TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies...
6 months ago
Chinese manufacturers to benefit from CoWoS-like structures and TSMC order surplus
DigiTimes
The CoW+WoS Model: Industry Adaptation and Chinese Participation. Chinese AI chip designers with access to TSMC's services prioritize TSMC over SMIC. SMIC lags...
4 months ago
Exclusive: TSMC considering advanced chip packaging capacity in Japan, sources say
Reuters
Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum...
7 months ago
TSMC Readies 8x Reticle Super Carrier Interposer For Next-Gen Chips Twice as Large As Today's
AnandTech
TSMC announced that they are developing the means of building super-sized interposers that can reach over 8x the reticle limit.
6 months ago
TSMC¡¦s Entire CoWoS Supply Reportedly Reserved By NVIDIA & AMD Until 2025
Wccftech
AMD & NVIDIA have reportedly reserved TSMC's entire CoWoS production for the next two years as both firms aggressively compete in the AI race.
5 months ago
TSMC to see CoWoS production capacity reach 60,000 wafers in 2025
DigiTimes
The just acquired 5.5G panel fab would enable TSMC to boost its overall production capacity for CoWoS packaging to 60000 wafers per month in 2025,...
2 months ago