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TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027

DIGITIMES Asia
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027,...
1 day ago

TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

MSN
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
4 days ago

[News] TSMC on Track to Qualify Ultra-Large CoWoS with 9x Reticle Sizes, 12 HBM4 Stacks by 2027

TrendForce
According to a report from TechNews, citing Tom's Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large ...
5 days ago

TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks

Yahoo
TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
6 days ago

TSMC's CoWoS far from secure: Etron CEO flags Intel EMIB's rising threat

DIGITIMES Asia
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75000 units...
6 days ago

TSMC To Significantly Upscale ˇ§CoWoSˇ¨ Production Within The Upcoming Quarters, Reaching Up To 130,000 Monthly Output By 2026

Wccftech
TSMC is "rushing" towards improving CoWoS production as the immense demand from the markets starts to gobble up the whole supply chain.
1 week ago

The 7nm chip sanctions on China: impact on large-scale chips, CoWoS processes

DigiTimes
On November 8, news broke that China's 7nm chip manufacturing supply was cut off, prompting major foundries like TSMC and Samsung Foundry to remain silent.
1 week ago

Taiwan Semiconductor Manufacturing Company Limited (TSM) Poised for Growth as NVIDIA Drives AI Demand, Citi Highlights Doubling CoWoS Capacity by 2025

Yahoo Finance
We recently compiled a list of the 15 AI Stocks Making Waves on Wall Street. In this article, we are going to take a look at where Taiwan Semiconductor...
1 week ago

Nvidia secures 60% of TSMC's doubled CoWoS capacity for 2025

DIGITIMES Asia
TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia...
1 week ago

[News] TSMC Reportedly Slows Down CoWoS Capacity Expansion for 2026

TrendForce
According to a report by Money DJ, TSMC, the global leader in semiconductor foundry, has recently notified domestic and international equipment suppli...
1 week ago