According to a report from Commercial Times, TSMC is actively expanding its advanced packaging facilities in Taiwan. With the Tainan facility (AP8) it...
1 day ago

According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh...
1 day ago

NVIDIA's next-generation GB300 'Blackwell Ultra' AI servers expected to debut in mid-2025: fully-liquid cooled, 12-Hi HBM3E memory, TSMC CoWoS-L packaging.
1 week ago

TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and...
2 weeks ago

TSMC's CoWoS gets even bigger with 9-reticle size packages due in 2027.
2 weeks ago

TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75000 units...
2 weeks ago

TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine...
2 weeks ago

TSMC is "rushing" towards improving CoWoS production as the immense demand from the markets starts to gobble up the whole supply chain.
2 weeks ago

TSMC is also reportedly negotiating to acquire a second facility from Innolux. Meanwhile, its Chiayi fab is targeting equipment delivery by the end of 2025 and...
3 weeks ago

TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia...
3 weeks ago